Method for checking a wire bond of a semiconductor package

Details Method for checking a wire bond of a semiconductor package Method for checking a wire bond of a semiconductor package

1995-09-19

1998-01-27

Karlsen, Ernest F.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324537, G01R 3104

Patent

active

057125708

ABSTRACT:
A method for checking wire bonding result of a ball grid array (BGA) package is disclosed. An electroconductive metal layer of gold or copper is grounded on a chip bonding portion of a printed circuit board (PCB) of the BGA package as well as on a passage extending between the chip bonding portion and the gate of the PCB. After a wire bonding step, a probe and a capillary of a wire bonding checking system contact with the gate and with a semiconductor chip respectively. Thereafter, an electric current is sent to the BGA package from the checking system so as to check whether the BGA package sends the electric current therethrough. When there is neither a lift bond nor a missing wire in the BGA package, the package will send the current. However, when there is either a lift bond or the missing wire in the BGA package, the package will not send the current.

REFERENCES:
patent: 3975680 (1976-08-01), Webb
patent: 4056773 (1977-11-01), Sullivan
patent: 4186338 (1980-01-01), Fichtenbaum
patent: 4563636 (1986-01-01), Snook et al.
patent: 5059897 (1991-10-01), Aton et al.
patent: 5124660 (1992-06-01), Cilingiroglu
patent: 5254953 (1993-10-01), Crook et al.
patent: 5275058 (1994-01-01), Pham et al.
patent: 5489851 (1996-02-01), Heumann et al.
patent: 5557209 (1996-09-01), Crook et al.

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