Method of transferring and mounting elements

Details Method of transferring and mounting elements Method of transferring and mounting elements

2005-11-08

2005-11-08

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S830000, C029S833000, C029S834000, C029S564100, C257S066000, C438S030000, C438S158000

Reexamination Certificate

active

06961993

ABSTRACT:
A device mounting method capable of efficiently, accurately arraying micro-devices on a circuit board is provided. The method includes a device separating step of separating a plurality of LED chips, which have been arrayed with a specific period on a wafer, into individual LED chips while keeping the arrayed state of the LED chips as it is, a device re-arraying step of handling the individually separated LED chips so as to re-array the LED chips at intervals of a value equivalent to the period multiplied by a specific magnification, and a device transferring step of transferring the re-arrayed LED chips on a mounting board while keeping the re-arrayed state of the LED chips as it is.

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