PVD target constructions comprising projections

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

Reexamination Certificate

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Reexamination Certificate

active

06955748

ABSTRACT:
The invention includes PVD targets having non-sputtered regions (such as, for example, sidewalls), and particle-trapping features formed along the non-sputtered regions. In particular aspects, the particle-trapping features can comprise a pattern of bent projections forming receptacles, and can comprise microstructures on the bent projections. The targets can be part of target/backing plate constructions, or can be monolithic. The invention also includes methods of forming particle-trapping features along sidewalls of a sputtering target or along sidewalls of a target/backing plate construction. The features can be formed by initially forming a pattern of projections along a sidewall. The projections can be bent and subsequently exposed to particles to form microstructures on the bent projections.

REFERENCES:
patent: 5269403 (1993-12-01), Pouliquen et al.
patent: 5474649 (1995-12-01), Kava et al.
patent: 5942041 (1999-08-01), Lo et al.
patent: 6277194 (2001-08-01), Thilderkvist et al.
patent: 6503380 (2003-01-01), Buehler
patent: 2002/0079217 (2002-06-01), Buehler
patent: 2001-316798 (2001-11-01), None
PCT Search report US03/22107.
PCT Search report. US04/14800.

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