Optical package substrate and optical device

Details Optical package substrate and optical device Optical package substrate and optical device

2005-09-20

2005-09-20

Lee, John D. (Department: 2874)

Optical waveguides

With optical coupler

Particular coupling structure

C385S047000, C385S048000

Reexamination Certificate

active

06947645

ABSTRACT:
An optical package substrate and a molding method therefor which provide for easy production, easy mounting of optical elements such as photodiodes and lasers, good functionality, productivity and economy, and an optical device incorporating the package substrate. On the surface of an optical package substrate, a guide groove used for the positioning of an optical fiber and a tapered face adjoining the guide groove are provided, the tapered face being formed to have a predetermined angle. A mirror for reflecting light is formed on the tapered face. An optical fiber is affixed in the guide groove. A surface reception type photodiode, which is placed in a position for receiving light deflected by the mirror, is mounted above the tapered face. By providing a positioning marker for a light receiving element on the optical package substrate, it becomes particularly easy to mount the surface reception type photodiode through passive alignment.

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Three Dimensional Micromachining with Precision on the Order of Submicrons—Ultra-Micro Discharge Machine—Optical Alliance, Mar., 1995, pp. 28-31, in Japanese.

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