Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2005-04-26
2005-04-26
Haran, John T. (Department: 1733)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C257S783000, C257S924000, C340S539100, C340S572100, C361S679090, C174S050510
Reexamination Certificate
active
06885089
ABSTRACT:
A curable adhesive composition, comprising an epoxy terminated silane is provided. A thin profile battery and a substrate to which the thin profile battery is to be conductively connected are also provided. The adhesive composition is interposed between the battery and the substrate, and cured into an electrically conductive bond between the battery and the substrate. In another aspect, a curable epoxy composition is interposed between first and second electrically conductive components. The epoxy has an effective metal surface wetting concentration of silane to form a cured electrical interconnection having a resistance through said electrical components of less than or equal to about0.3ohm-cm2. In another aspect, a battery powerable apparatus, i.e. an Rf communication device, includes a conductive adhesive mass comprising an epoxy terminated silane. Also, the invention includes an electric circuit comprising first and second electric components electrically connected with one another through a conductive adhesive mass.
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Haran John T.
Micro)n Technology, Inc.
Wells St. John P.S.
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