High density, miniaturized arrays and methods of...

Details High density, miniaturized arrays and methods of... High density, miniaturized arrays and methods of...

2005-01-11

2005-01-11

Lipman, Bernard (Department: 1713)

Stock material or miscellaneous articles

Composite

Of silicon containing

C428S518000, C428S523000, C525S330300, C525S330500, C525S330600, C525S330700, C525S375000, C525S383000, C525S384000

Reexamination Certificate

active

06841258

ABSTRACT:
High-density, miniaturized arrays including high surface areas. Arrays described include substrate with a coating of linking agents, as well as arrays with reactants affixed to the substrates. Methods of manufacturing high-density arrays of reactants. The methods include the use of oriented, heat shrink films and elastomeric materials. Methods of functionalizing a substrate with linking agents for subsequent affixation of reactants are also disclosed herein.

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Product Information: “Cryovac® D-955 Film,” Cryovac Division, W.R. Grace & Co., (date unknown) two pages.

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