Method for producing metal/ceramic bonding circuit board

Details Method for producing metal/ceramic bonding circuit board Method for producing metal/ceramic bonding circuit board

2005-07-19

2005-07-19

Stoner, Kiley S. (Department: 1725)

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

C228S159000, C216S041000

Reexamination Certificate

active

06918529

ABSTRACT:
After copper plates14are bonded to both sides of a ceramic substrate10via a brazing filler metal12, UV curing alkali peeling type resists16are applied on predetermined portions of the surfaces of the copper plates14to etch undesired portions of the copper plates14to form a metal circuit portion. While the resists16are maintained, undesired portions of the brazing filler metal12and a reaction product, which is produced by a reaction of the brazing filler metal12with the ceramic substrate10, are removed (or undesired portions of the brazing filler metal12and a reaction product, which is produced by a reaction of the brazing filler metal12with the ceramic substrate10, are removed, and the side portion of the metal circuit portion is etched). Thereafter, the resists16are peeled off, and an Ni—P electroless plating18is carried out. Thus, in a method for producing a metal/ceramic bonding circuit board, it is possible to easily control the sectional shape of a metal/ceramic bonding circuit board by a smaller number of steps and at low costs, and it is possible to produce a metal/ceramic bonding circuit board which is more reliable with respect to thermal shock resistance and insulation performance.

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