Multi-layer circuit board and method of manufacturing the same

Details Multi-layer circuit board and method of manufacturing the same Multi-layer circuit board and method of manufacturing the same

2005-07-05

2005-07-05

Thompson, Craig A. (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S107000, C257S791000, C257S787000, C257SE39011

Reexamination Certificate

active

06913947

ABSTRACT:
A multi-layer circuit board is manufactured by laminating and bonding together a plurality of resin films, on each of which a circuit pattern is directly drawn by injecting ink. The ink includes metal particles, having a diameter in the order of nanometers, dispersed therein. At the same time when the laminated resin films are bonded together under pressure and heat, the metal particles in the ink are sintered, thereby forming a solid electrical circuit printed on the resin film. Since the circuit pattern is directly drawn on the resin film, the process of manufacturing the multi-layer circuit board is simplified.

REFERENCES:
patent: 5672226 (1997-09-01), Deardorf
patent: 6228467 (2001-05-01), Taniguchi et al.
patent: A-H11-163499 (1999-06-01), None
patent: A-2002-134878 (2002-05-01), None

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