Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2005-01-11
2005-01-11
Flynn, Nathan J. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S692000, C257S773000
Reexamination Certificate
active
06841864
ABSTRACT:
A semiconductor integrated circuit device according to the present invention comprises, a semiconductor chip formed with a semiconductor integrated circuit, at least one pair of previous-stage power supply terminals provided on the semiconductor chip and connected to a power supply line, a plurality of pairs of subsequent-stage power supply terminals provided on the semiconductor chip and connected to the power supply line connected commonly to the at least one pair of previous-stage power supply terminals, at least one previous-stage line providing a connection between the at least one pair of previous-stage power supply terminals, and subsequent-stage lines equal in number to the plurality of pairs of subsequent-stage power supply terminals and each providing a connection between the corresponding one of the plurality of pairs of subsequent-stage power supply terminals, wherein the at least one pair of previous-stage power supply terminals and the plurality of pairs of subsequent-stage power supply terminals are connected to each other to form a closed circuit when they are mounted on a mounting board.
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patent: 6448636 (2002-09-01), Suenaga et al.
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patent: 2-280359 (1990-11-01), None
Harper, Electronic Packaging Interconnection Handbook, 1991, McGraw-Hill, 8.1-8.2.
Andújar Leonardo
Flynn Nathan J.
Matsushita Electric - Industrial Co., Ltd.
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