Semiconductor device and manufacturing method thereof

Details Semiconductor device and manufacturing method thereof Semiconductor device and manufacturing method thereof

2005-01-04

2005-01-04

Nelms, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

Reexamination Certificate

active

06838765

ABSTRACT:
The present invention comprises a first main face (22a) on a surface side of a substrate (21a). An island portion (26) is formed on the first main face (22a) and a semiconductor chip (29), etc. are adhered thereto. The semiconductor chip (29), etc. are sealed in the hollow portion that is constructed by a column portion (23) and a transparent glass plate (36). Then, the column portion (23) and the transparent glass plate (36) are adhered by epoxy resin, or the like.

REFERENCES:
patent: 4651192 (1987-03-01), Matsushita et al.
patent: 5397918 (1995-03-01), Yokochi et al.
patent: 5923958 (1999-07-01), Chou
patent: 6100108 (2000-08-01), Mizuno et al.
patent: 6255376 (2001-07-01), Shikata et al.
patent: 6285067 (2001-09-01), Hyoudo et al.
patent: 6313525 (2001-11-01), Sasano
patent: 19752196 (1999-02-01), None
patent: 19959938 (2000-10-01), None
patent: 0997934 (2000-05-01), None
patent: 01134956 (1989-05-01), None
patent: HEI10-173117 (1998-06-01), None

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