Wafer level burn-in using light as the stimulating signal

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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Details

C324S754120

Reexamination Certificate

active

06885203

ABSTRACT:
An apparatus comprises multiple light sources that are applied to specific locations on the surface of a wafer for the purpose of causing a component on a die to respond as if a digital signal had been applied to the component. The multiple light sources may comprise several thousand point light sources such as the individual fibers of a fiber optic bundle. The light is controlled in such a manner to stimulate operation of the electronic circuit for the purpose of burning in the circuit.

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Article entitled, “Securing Known Good Die”, by T. A. Williams, published in Advanced Packaging, Fall 1992, pp. 50-59.
Article entitled, Known-Good Die Poised to Take Off, by D. Maliniak, published in Electronic Design, Nov. 21, 1994, pp. 55-73.
Article entitled, Burn-In Co-Developed by TI, MicroModule System, Intel Launches ‘SmartDie’ Program, by Jim Detar, published in Electronic News, May 30, 1994.
Article entitled, “Known Good Die: A Commercial Solution for Burn-in and Test Before Packaging” by S-H Foo and L. Prokopchak, presented at Semicon Japan, Dec. 1994.
Article entitled, “Flexibility and Modularity Drive Today's Burn-In/Test Systems” by P. Mayerfeld, reprinted from EE-Evaluation Engineering, Nov. 1994.
Specification entitled, “Known Good Die—The Total Solution”, AEHR Test Systems/Nitto-Denko.

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