Robust interlocking via

Details Robust interlocking via Robust interlocking via

2005-09-20

2005-09-20

Thai, Luan (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S774000, C257S775000, C257S780000, C257S781000, C257S698000

Reexamination Certificate

active

06946737

ABSTRACT:
The invention provides a via with improved resistance to failures due to delamination voids. In one embodiment, the via may extend from above to below a bottom conductor and include an anchor section. The anchor section may mechanically interlock the via with the bottom conductor to prevent the via from being detached from the bottom conductor.

REFERENCES:
patent: 5129142 (1992-07-01), Bindra et al.
patent: 5191709 (1993-03-01), Kawakami et al.
patent: 5293504 (1994-03-01), Knickerbocker et al.
patent: 6079100 (2000-06-01), Farquhar et al.
patent: 6335565 (2002-01-01), Miyamoto et al.
patent: 6441494 (2002-08-01), Huang et al.

Affiliated with

Also associated with

Rating

Robust interlocking via does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Robust interlocking via, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Robust interlocking via will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3428346