Compositions – Electrically conductive or emissive compositions
Reexamination Certificate
2005-07-12
2005-07-12
Kopec, Mark (Department: 1751)
Compositions
Electrically conductive or emissive compositions
C252S511000, C252S512000, C252S514000, C257S783000, C257S786000, C428S402000, C427S212000
Reexamination Certificate
active
06916433
ABSTRACT:
A conductive adhesive comprises main components of a conductive filler and a binder resin, and a content of the conductive filler is in a range from 20 wt % to 70 wt %. It is preferable that at least a part of the conductive filler has protrusions. A dendrite metal filler is especially preferred. When this adhesive is compressed, the resin component is squeezed out, while the conductive filler component remains inside. As a result, the concentration of the conductive filler component is raised inside, and this is useful in connecting the electrodes by scratching the surfaces of the electrodes. No solder is required in forming a conductive adhesive3on a substrate electrode2of a circuit substrate1and also for packaging an electronic element4. Provided also are a package of an electronic element using the conductive adhesive with improved initial and long-term reliability, and a method of packaging the same.
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Ishimaru Yukihiro
Kitae Takashi
Mitani Tsutomi
Suzuki Yasuhiro
Takezawa Hiroaki
Kopec Mark
Matsushita Electric - Industrial Co., Ltd.
Merchant & Gould P.C.
Vijayakumar Kallambella
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