Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2005-05-17
2005-05-17
Flynn, Nathan J. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S499000, C257S723000, C257S724000, C257S726000, C257S737000
Reexamination Certificate
active
06894396
ABSTRACT:
A semiconductor device comprises a carrier substrate, an integrated circuit chip mounted on the carrier substrate via bumps, and a capacitor provided to stabilize operation of the integrated circuit chip at high frequencies. In the semiconductor device, the capacitor is electrically connected to pads on bottom of the integrated circuit chip, and the capacitor is provided to have a height on the carrier substrate that is smaller than or equal to a height of the bumps on the carrier substrate.
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patent: 5548474 (1996-08-01), Chen et al.
patent: 6404615 (2002-06-01), Wijeyesekera et al.
patent: 6-224257 (1994-08-01), None
patent: 7-111226 (1995-04-01), None
patent: 09199374 (1997-07-01), None
patent: 2001-102512 (2001-04-01), None
Baniecki John David
Kurihara Kazuaki
Shioga Takeshi
Yamagishi Yasuo
Flynn Nathan J.
Forde Remmon R.
Fujitsu Limited
Westerman Hattori Daniels & Adrian LLP
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