Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material
Reexamination Certificate
2005-05-17
2005-05-17
Duong, Tho v (Department: 3743)
Heat exchange
Intermediate fluent heat exchange material receiving and...
Liquid fluent heat exchange material
C165S067000, C165S104210, C361S700000
Reexamination Certificate
active
06892801
ABSTRACT:
A thermal control apparatus using heat pipes. The thermal control apparatus includes a heat pipe having a hollow interior at least partially filled with a vaporizable liquid. The heat pipe further includes a threaded outer surface configured for coupling the heat pipe into an aperture having a threaded inner surface. The threaded outer surface maybe an integral portion of the heat pipe, or may be implemented using a separate piece that coupled to the heat pipe. A thermal control apparatus using the heat pipes may be implemented with a heat spreader having one or more apertures, wherein each of the apertures includes a threaded inner surface. A heat pipe having a threaded outer surface may be positioned in one of the apertures. The thermal control apparatus may be mounted on a printed circuit board in the proximity of one or more electronic components.
REFERENCES:
patent: 3769551 (1973-10-01), Corman et al.
patent: 4005297 (1977-01-01), Cleaveland
patent: 4131785 (1978-12-01), Shutt
patent: 4389002 (1983-06-01), Devellian et al.
patent: 4638854 (1987-01-01), Noren
patent: 4688537 (1987-08-01), Calkins et al.
patent: 5095403 (1992-03-01), Pin et al.
patent: 5949647 (1999-09-01), Kolman et al.
patent: 6179841 (2001-01-01), Jackson
patent: 6385044 (2002-05-01), Colbert et al.
patent: 6625021 (2003-09-01), Lofland et al.
patent: 6785135 (2004-08-01), Ohmi et al.
patent: 6788537 (2004-09-01), Saita et al.
patent: WO0014469 (2000-03-01), None
Duong Tho v
Kivlin B. Noäl
Meyertons Hood Kivlin Kowert & Goetzel P.C.
Sun Microsystems Inc.
LandOfFree
Thermal control apparatus for electronic systems does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thermal control apparatus for electronic systems, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal control apparatus for electronic systems will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3426080