Method for making a socket to perform testing on integrated...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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C029S825000, C029S840000, C029S843000, C029S870000, C029S874000, C029S877000, C029S878000, C029S885000, C324S356000, C439S054000

Reexamination Certificate

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06920689

ABSTRACT:
A interconnect structure is inexpensively manufactured and easily insertable into a socket. The interconnect structure is manufactured by forming a sacrificial substrate with cavities that is covered by a masking material having openings corresponding to the cavities. A first plating process is performed by depositing conductive material, followed by coupling wires within the openings and performing another plating process by depositing more conductive material. The interconnect structure is completed by first removing the masking material and sacrificial substrate. Ends of the wires are coupled opposite now-formed contact structures to a board. To complete the socket, a support device is coupled to the board to hold a tested integrated circuit.

REFERENCES:
patent: 5772451 (1998-06-01), Dozier et al.
patent: 5806181 (1998-09-01), Khandros et al.
patent: 5917707 (1999-06-01), Khandros et al.
patent: 6256882 (2001-07-01), Gleason et al.
patent: 6292003 (2001-09-01), Fredrickson et al.
patent: 2001/0009376 (2001-07-01), Takekoshi et al.
patent: 2002/0027445 (2002-03-01), Sausen
patent: WO 96/15458 (1996-05-01), None

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