Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2005-07-19
2005-07-19
Zarneke, David A. (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S107000, C438S108000, C257S737000, C257S738000, C257S773000, C257S780000
Reexamination Certificate
active
06919227
ABSTRACT:
A semiconductor part for component mounting, a mounting structure and a mounting method providing ample surplus wiring pitch and width between terminals in order to improve the strength of the connection with the printed circuit board in view of the recent trends towards a greater number of pins and greater component mounting density on printed circuit boards or substrates. A semiconductor component for mounting has area terminals comprised of area terminals mounted on the outer circumferential side and area terminals mounted on the inner circumferential side of the board. The area terminals on the outer circumferential side of the board are arranged with a larger pitch and or diameter than the area terminals on the inner circumferential side. A mounting method and mounting structure having land terminals arrayed on a printed circuit board or substrate with the same arrangement as the area terminals of the semiconductor component, and the land terminals are connected with the area terminals by a conductive bonding agent.
REFERENCES:
patent: 5490324 (1996-02-01), Newman
patent: 5598036 (1997-01-01), Ho
patent: 5828128 (1998-10-01), Higashiguchi et al.
patent: 6175158 (2001-01-01), Degani et al.
patent: 6184586 (2001-02-01), Matsushima
Sonnenschein Nath & Rosenthal LLP
Sony Corporation
Tran Thanh Y.
Zarneke David A.
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