Test head assembly for electronic components with plurality...

Details Test head assembly for electronic components with plurality... Test head assembly for electronic components with plurality...

2005-05-03

2005-05-03

Pert, Evan (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

Reexamination Certificate

active

06888362

ABSTRACT:
An electronic component is disclosed, having a plurality of microelectronic spring contacts mounted to a planar face of the component. Each of the microelectronic spring contacts has a contoured beam, which may be formed of an integral layer of resilient material deposited over a contoured sacrificial substrate, and comprises a base mounted to the planar face of the component, a beam connected to the base at a first end of the beam, and a tip positioned at a free end of the beam opposite to the base. The beam has an unsupported span between its free end and its base. The microelectronic spring contacts are advantageously formed by depositing a resilient material over a molded, sacrificial substrate. The spring contacts may be provided with various innovative contoured shapes. In various embodiments of the invention, the electronic component comprises a semiconductor die, a semiconductor wafer, a LGA socket, an interposer, or a test head assembly.

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