Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching
Reexamination Certificate
2005-05-24
2005-05-24
Smith, Matthew (Department: 2825)
Semiconductor device manufacturing: process
Chemical etching
Liquid phase etching
C134S001300, C134S021000
Reexamination Certificate
active
06897161
ABSTRACT:
A component having small holes, such as a silicon electrode plate having gas nozzles, used in a plasma processing apparatus is cleaned by producing a cavitation zone that extends through an entire depth of the holes so that deposited layers on the inner walls of the holes formed during the use in the apparatus are removed. The cleaned component can subsequently be re-used in the apparatus, and the production cost and the consumption of natural resources are decreased.
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Kawasaki Microelectronics Inc.
Malsawma Lex H.
Smith Matthew
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