Thermally conductive gasket device

Details Thermally conductive gasket device Thermally conductive gasket device

1991-06-27

1992-08-11

Cuchlinski, Jr., William A.

Seal for a joint or juncture

Seal between relatively movable parts

Relatively rotatable radially extending sealing face member

277 22, 277 26, 277 9, 277235R, 285187, 29447, F16J 1502

Patent

active

051372835

ABSTRACT:
A gasket is formed by encapsulating a thermally conductive low melting temperature material or core in a plastic skin. The low melting temperature material conforms to the shape of the interface completely filling all voids once heated above its melting temperature. Since the low melting temperature material is encapsulated in a plastic skin, there is no danger of contaminating parts of the assembly. The gasket is easily applied and removed in all applications, is re-usable, and the thickness can be as thin as 0.010 inches.

REFERENCES:
patent: 1211476 (1917-02-01), Miller
patent: 3299905 (1967-01-01), Smirra
patent: 3897087 (1975-07-01), Nielson
patent: 4061344 (1977-12-01), Bradley et al.
patent: 4441721 (1984-04-01), Harris et al.
patent: 4485138 (1988-11-01), Yamamoto et al.
patent: 4487432 (1984-12-01), Passerell et al.
patent: 4776602 (1988-10-01), Gallo
patent: 4817963 (1989-04-01), Munden et al.

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