Polymer composition containing clean filler incorporated...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...

Reexamination Certificate

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C523S200000

Reexamination Certificate

active

06946513

ABSTRACT:
There is provided an elastomer composition which is prepared by using a very clean filler reduced in both of an amount of moisture generation and an amount of organic outgas generation and is suitable as a molding material for semiconductor production apparatuses and there is provided a molded article. The composition is a crosslinkable composition comprising a high molecular weight polymer, particularly a crosslinkable fluorine-containing elastomer and a filler which has a weight reduction ratio per unit surface area of not more than 2.5×10−5% by weight/m2when heating at 200° C. for two hours and a total amount of organic gas generated of not more than 2.5 ppm when heating at 200° C. for 15 minutes. The molded article is produced from the crosslinkable composition.

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International Preliminary Examination Report for PCT/JP01/03686 dated Feb. 5, 2002.
Supplementary European Search Report for EP 01 92-6012 dated May 21, 2003.

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