Power semiconductor package with strap

Details Power semiconductor package with strap Power semiconductor package with strap

2005-03-29

2005-03-29

Loke, Steven (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S693000, C257S687000, C257S690000

Reexamination Certificate

active

06873041

ABSTRACT:
A semiconductor package and a method for fabricating a semiconductor package are disclosed. In one embodiment, the semiconductor package includes an exposed portion of a conductive strap at a package horizontal first surface and exposed surfaces of multiple leads at a package horizontal second surface. A power semiconductor die is mounted on a die pad connected to at least one lead having an exposed surface. Heat generated by the die within the package may be dissipated through thermal paths including the exposed surfaces.

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