Soldering agent for use in diffusion soldering processes,...

Details Soldering agent for use in diffusion soldering processes,... Soldering agent for use in diffusion soldering processes,...

2005-03-29

2005-03-29

Jones, Deborah (Department: 1775)

Stock material or miscellaneous articles

All metal or with adjacent metals

Having metal particles

C428S553000, C428S557000, C428S560000, C428S564000, C228S193000

Reexamination Certificate

active

06872464

ABSTRACT:
A soldering agent for use in diffusion soldering processes contains, in a soldering paste, a mixture of at least partially metallic grains of a high-melting metal and a solder metal. In a diffusion soldering process, the solder metal reacts completely with the high-melting metal and metals belonging to parts that are to be joined to one another by the soldering process, to form an intermetallic phase.

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Nakao, Y. et al.: “Diffusionslöten von Nickelbasissuperlegierungen über temporäre diffusionsgesteuerte Flüssigphasen” [Diffusion-Soldering of Nickel Based Super Alloys over Temporary Diffusion-Controlled Liquid Phases], Schweissen und Schneiden, No. 44, Issue 2, 1992, pp. 87-92.
Chang, H. et al.: “Electroless Silver Plating of Oxide Particles in Aqueous Solution”, Journal of Materials Science, No. 28, 1993, pp. 5207-5210.

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