Optics: measuring and testing – Inspection of flaws or impurities – Surface condition
Reexamination Certificate
2005-09-13
2005-09-13
Pham, Hoa Q. (Department: 2877)
Optics: measuring and testing
Inspection of flaws or impurities
Surface condition
C356S237500
Reexamination Certificate
active
06943876
ABSTRACT:
A method and apparatus for detecting pattern defects which includes annularly scanning of a laser beam emitted from a laser light source on a pupil of an objective lens, illuminating the scanned laser beam, through the objective lens, onto a sample on which there is formed a pattern coated with an optically transparent thin film, acquiring an optical image of the illuminated sample, and processing the acquired image to find defects in the pattern. The annular scan diameter of the laser beam is determined based on the thickness of the optically transparent thin film.
REFERENCES:
patent: 4812748 (1989-03-01), Brust et al.
patent: 4930896 (1990-06-01), Horikawa
patent: 5649022 (1997-07-01), Maeda et al.
patent: 5764363 (1998-06-01), Ooki et al.
patent: 5774222 (1998-06-01), Maeda et al.
patent: 5932871 (1999-08-01), Nakagawa et al.
patent: 6091075 (2000-07-01), Shibata et al.
patent: 6556290 (2003-04-01), Maeda et al.
patent: 6621571 (2003-09-01), Maeda et al.
patent: 6800859 (2004-10-01), Shishido et al.
patent: 2003/0095251 (2003-05-01), Maeda et al.
patent: 2005/0083519 (2005-04-01), Maeda et al.
patent: 61-212708 (1986-09-01), None
patent: 8-320294 (1996-12-01), None
patent: 11-271213 (1999-10-01), None
Maeda Shunji
Nakata Toshihiko
Uto Sachio
Yoshida Minoru
Antonelli Terry Stout & Kraus LLP
Pham Hoa Q.
LandOfFree
Method and apparatus for detecting pattern defects does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for detecting pattern defects, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for detecting pattern defects will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3414698