Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal
Reexamination Certificate
2005-05-10
2005-05-10
Le, Dung A. (Department: 2818)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
C438S050000, C438S051000
Reexamination Certificate
active
06890787
ABSTRACT:
A method for protecting intermediate conductive elements, such as bond wires, of semiconductor device assemblies, includes sequentially fabricating one or more material layers of one or more protective structures to be associated with the intermediate conductive elements. After a first layer is formed, each subsequent layer is superimposed upon, contiguous with, and mutually adhered to an underlying layer of the protective structure.
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Webpage, Objet Prototyping the Future, Objet FullCare700 Series, 1 page.
Webpage, Objet Prototyping the Future, How it Works, 2 page.
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