Electrical circuit assembly with micro-socket

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

Reexamination Certificate

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Reexamination Certificate

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06881074

ABSTRACT:
An assembly of the present invention has an integrated circuit device electrically and mechanically connected to the substrate. At least one electrically conductive connecting element is on one of the substrate and circuit device and at least one socket is on the other of the substrate and circuit device. The socket receives the at least one connecting element and comprises at least two resilient members. The resilient members are biased against the connecting element so that the circuit device and the substrate are held in electrical and mechanical connection by the biasing force of the resilient members against the connecting element.

REFERENCES:
patent: 3526867 (1970-09-01), Keeler, II
patent: 3585569 (1971-06-01), Moran
patent: 3825876 (1974-07-01), Damon et al.
patent: 4526429 (1985-07-01), Kirkman
patent: 4601526 (1986-07-01), White et al.
patent: 4657336 (1987-04-01), Johnson et al.
patent: 4746300 (1988-05-01), Thevenin
patent: 4950173 (1990-08-01), Minemura et al.
patent: 5046972 (1991-09-01), Pass
patent: 5059130 (1991-10-01), Miller, Jr.
patent: 5110298 (1992-05-01), Dorinski et al.
patent: 5299939 (1994-04-01), Walker et al.
patent: 5312456 (1994-05-01), Reed et al.
patent: 5411400 (1995-05-01), Subrahmanyan et al.
patent: 5439162 (1995-08-01), George et al.
patent: 5457610 (1995-10-01), Bernardoni et al.
patent: 5479105 (1995-12-01), Kim et al.
patent: 5561594 (1996-10-01), Wakefield
patent: 5634267 (1997-06-01), Farnworth et al.
patent: 5665654 (1997-09-01), Stansbury
patent: 5677203 (1997-10-01), Rates
patent: 5746608 (1998-05-01), Taylor
patent: 5772451 (1998-06-01), Dozier, II et al.
patent: 5774341 (1998-06-01), Urbish et al.
patent: 5903059 (1999-05-01), Bertin et al.
patent: 5917707 (1999-06-01), Khandros et al.
patent: 6093053 (2000-07-01), Horioka et al.
patent: 6166556 (2000-12-01), Wang et al.
patent: 6179625 (2001-01-01), Davis et al.
patent: 6200143 (2001-03-01), Haba et al.
patent: 6214642 (2001-04-01), Chen et al.
patent: 6247938 (2001-06-01), Rathburn
patent: 6345991 (2002-02-01), Daoud
patent: 6352436 (2002-03-01), Howard
patent: 6396711 (2002-05-01), Degani et al.
patent: 6427899 (2002-08-01), Hembree et al.
patent: 6450839 (2002-09-01), Min et al.
patent: 6492737 (2002-12-01), Imasu et al.
patent: 6493932 (2002-12-01), Haba
patent: 6560861 (2003-05-01), Fork et al.
patent: 20020164893 (2002-11-01), Mathieu et al.

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