System on a chip device including a re-wiring layer formed...

Details System on a chip device including a re-wiring layer formed... System on a chip device including a re-wiring layer formed...

2005-05-17

2005-05-17

Le, Dung A. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S678000, C438S460000

Reexamination Certificate

active

06894395

ABSTRACT:
An LSI unit provided by the present invention comprises a molded LSI chip having bonding pads, and another LSI chip having another set of bonding pads which is placed on the molded LSI chip and electrically connected the molded LSI chip through bumps. In this LSI unit, the LSI chip is molded in a molding material, a re-wiring layer is formed, and bonding pads of the molded LSI chip are formed so as to correspond to the position of another set of bonding pads of another LSI chip, where the bonding pads of the molded LSI chip are formed over the molding material. Thus another LSI chip even larger in size than the molded LSI chip can be placed on the molded LSI chip and can be electrically connected thereto.

REFERENCES:
patent: 6707244 (2004-03-01), Kimiya et al.
patent: 6724084 (2004-04-01), Hikita et al.
patent: 20020056899 (2002-05-01), Hikita et al.

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