Heat dissipation apparatus and method

Details Heat dissipation apparatus and method Heat dissipation apparatus and method

2005-09-06

2005-09-06

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S690000, C361S694000, C257S722000, C174S016300, C165S104330

Reexamination Certificate

active

06940718

ABSTRACT:
Disclosed are a heat dissipation computer and method. In one embodiment, a heat dissipation apparatus comprises a heat sink that is adapted to receive a processor mounted thereto, the heat sink comprising an internal chamber that is adapted to receive a fluid flow that removes heat from the heat sink. In one embodiment, a method for dissipating heat generated by a processor comprises forcing fluid through an internal chamber formed within a heat sink to which the processor is mounted, forcing the fluid from the internal chamber of the heat sink through at least one hollow prong that extends from the heat sink and that is in fluid communication with the internal chamber of the heat sink, and forcing fluid over exterior surfaces of the at least one hollow prong.

REFERENCES:
patent: 5158136 (1992-10-01), Azar
patent: 5239443 (1993-08-01), Fahey et al.
patent: 5351748 (1994-10-01), Dagan
patent: 5583316 (1996-12-01), Kitahara et al.
patent: 5781411 (1998-07-01), Feenstra
patent: 6410982 (2002-06-01), Brownell et al.
patent: 6490160 (2002-12-01), Dibene et al.
patent: 6666260 (2003-12-01), Tantoush
patent: 6817405 (2004-11-01), Kamath et al.
patent: 6820684 (2004-11-01), Chu et al.
patent: 2002/0149912 (2002-10-01), Chu
patent: 4402918 (1995-08-01), None
patent: 09017920 (1997-01-01), None

Affiliated with

Also associated with

Rating

Heat dissipation apparatus and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat dissipation apparatus and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipation apparatus and method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3407998