Mold clamping apparatus and mold clamping method

Details Mold clamping apparatus and mold clamping method Mold clamping apparatus and mold clamping method

2005-05-17

2005-05-17

Jones, David (Department: 3725)

Metal deforming

By application of fluent medium, or energy field

Using fixed die

C072S062000, C072S455000, C029S421100, C029S512000

Reexamination Certificate

active

06892560

ABSTRACT:
A mold clamping apparatus includes a frame including a holding portion for holding a mold and an open portion allowing the mold to be inserted into/taken out from the holding portion in a direction of the longer side of the mold, a mold moving device for moving the mold to insert/take out the mold into/from the holding portion through the open portion in the frame, and a mold opening/closing device for opening/closing the mold located outside the frame. This mold clamping apparatus is capable of holding the mold securely in a closed state resisting a pressure acting to open the mold and allows reduction of energy consumption, equipment maintenance cost, production cost, and the size thereof.

REFERENCES:
patent: 4018150 (1977-04-01), Shiokawa
patent: 5211046 (1993-05-01), Inagaki
patent: 5482454 (1996-01-01), Miyahara
patent: 5582052 (1996-12-01), Rigsby
patent: 5600983 (1997-02-01), Rigsby
patent: 5755653 (1998-05-01), Nishida
patent: 6018971 (2000-02-01), Kleinschmidt
patent: 6041633 (2000-03-01), Bieling
patent: 6536251 (2003-03-01), Marando et al.
patent: 6634198 (2003-10-01), Dudziak
patent: 0 808 674 (1997-11-01), None
patent: (P) Sho 58-119426 (1983-07-01), None
patent: (P) Sho 60-96333 (1985-05-01), None
patent: (P) Hei 05-44396 (1993-06-01), None
patent: (P) Hei 09-174290 (1997-07-01), None
European Search Report (two pages), dated Sep. 20, 2002, with Annex (two pages), European Patent Application No. 114484.7 corresponding to this application.
Patent Abstracts of Japan, abstract (in English) of JP 05 329693 A.

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