Three-dimensional circuit modules

Details Three-dimensional circuit modules Three-dimensional circuit modules

1990-11-26

1992-07-14

Picard, Leo

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361400, 361409, 361412, 361414, 439 65, 439591, H05K 700

Patent

active

051308940

ABSTRACT:
Disclosed is a three-dimensional circuit structure particularly useful in semiconductor memories. The circuit structure consists of a stack of modules mounted on a mother board with connectors between adjacent modules in the stack. The connectors mate with staggered and through terminals on the modules; the staggered terminals being used for circuits routed to destinations on specific modules and the through terminals for circuits routed to destinations on more than one module.

REFERENCES:
patent: 5019946 (1991-05-01), Eichelberger et al.
"A 3-D System for Interconnection Meets the Challenge of High Density Packaging", M. Ansley, I.C.D.C., Ltd. Workingham, Berkshire, England, Electronic Packaging & Production, Apr. 1985.
"3-D Packaging Spawns Smaller, Faster Systems", Walter Shroen and Satwinder Malhi, Texas Instruments Inc. Dallas, TX, Surface Mount TechnologyAug. 1989.
"Three-Dimensional Multilayer Ceramic Wiring Structure for Semiconductor Devices", M. E. Ecker, IBM Technical Disclosure Bulletin, vol. 27, No. 5, Oct. 1984.
"Orthogonal Chip Mount--A 3D Hybrid Wafer Scale Integration Technology", by S. D. S. Malhi, H. E. Davis, R. J. Stierman, K. E. Bean, C. C. Driscol, P. K. Chatterjee, Semiconductor Process and Design Center, Texas Instrument Inc., Dallas, TX IEEE 1987.

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