Apparatus for making semiconductor device

Details Apparatus for making semiconductor device Apparatus for making semiconductor device

2005-05-31

2005-05-31

Davis, Robert B. (Department: 1722)

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

C425S125000, C425S127000, C425S129100, C425S215000, C425S216000, C425S544000

Reexamination Certificate

active

06899533

ABSTRACT:
A system for manufacturing a semiconductor device, comprises first and second metal molds (100a,100b) to form a cavity; a pair of plungers (102, 103) provided in cylinder holes (102a,103b) of the second metal mold (100b); a pressure supplying unit for pushing the plungers (102, 103) under a pressure lower than the injection pressure applied to the plunger (101) to form debris cavities (DC1,DC2) which absorb an excess resin, thereby reducing the height of a projection produced on the enclosing resin layer.

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