Multilayer printed circuit boards and multichip-module substrate

Details Multilayer printed circuit boards and multichip-module substrate Multilayer printed circuit boards and multichip-module substrate

1995-05-17

1997-02-11

Ryan, Patrick

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428901, 361748, B32B 900

Patent

active

056019025

ABSTRACT:
Multilayer printed circuit boards and multichip-module substrates having at least one layered composite of high-temperature-stable plastic and conductive tracks wherein the plastic is provided with a thin layer of amorphous, hydrogenated carbon (a--C:H) having a water permeation coefficient of <1.1.times.10.sup.-13 m.sup.2 /s. The a--C:H-layer also has a hardness gradient across it.

REFERENCES:
patent: 4977008 (1990-12-01), Squire
patent: 5139906 (1992-08-01), Doi
patent: 5399646 (1995-03-01), Kohara
"Multichip modules: next-generation packages", IEEE Spectrum, vol. 27 (1990), No. 3, pp. 24-48.
Reche, J. et al., "High Density Multichip Module Fabrication", The International Journal for Hybrid Microelectronics, vol. 13, No. 4, Dec. 1990, pp. 91-99.
Ruppel, D. et al., "Keramik/Metal/Polymer--Verbunde fur Multilayer-Multichip-Module", VDI Berichte, No. 933 (1991), pp. 265-283.
von Dr. H. Ahne, "Photostrukturierbare Passivier-und Isolierschichten", Fachtagung Polymerwerkstoffe fur die Elekronik, 14.-16. Oktober 1987, Wurzburg, Tagungsbericht (1987), pp. 153-165.
Hammerschmidt, A. et al., "Electrical Properties and Water Absorption of Polyimides and Related Materials Under Controlled Conditions", 1st European Technical Symposium on Polyimides, 10. bis 11, Mai 1989, Montpellier, Frankreich.

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