Drop generator die processing

Details Drop generator die processing Drop generator die processing

2005-04-26

2005-04-26

Tran, Thien F (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Physical configuration of semiconductor

With peripheral feature due to separation of smaller...

C257S797000

Reexamination Certificate

active

06885083

ABSTRACT:
Processing a die that has an edge and a substrate upon which a layer of moisture permeable material is disposed. The moisture permeable material extends to the edge of the die. One embodiment comprises interrupting the layer of moisture permeable material to form a gap at a boundary near the edge, thereby to substantially block movement of moisture through the gap of the moisture permeable material.

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U.S. Appl. No. 09/932,055, filed Aug. 16, 2001, Thermal Inkjet Printhead Processing With Silicon Etching.

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