Method of automatically debonding, processing, and handling...

Details Method of automatically debonding, processing, and handling... Method of automatically debonding, processing, and handling...

2005-01-18

2005-01-18

Osele, Mark A. (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

C156S583200, C029S426300, C029S426600

Reexamination Certificate

active

06843878

ABSTRACT:
An automatic thermal debonding process removes slider rows from a stainless steel processing fixture. The method uses a bimodal pitch adjustment and a mechanical row detainment mechanism to remove the rows from the fixture. The process allows full control of all critical process parameters such as accurate and repeatable row placement; controlled temperature and heat flow; controlled mechanical removal pressure; temporal control and variability; clean and contaminant-free working area; and full electrostatic discharge grounding and compatible materials. The bimodal pitch adjustment feature allows for continual, high-speed removal of the ceramic rows from the fixture after an automated heating cycle is complete. As the rows are removed, they are accurately placed into the detainment mechanism for the next process step.

REFERENCES:
patent: 4517041 (1985-05-01), Hennenfent et al.
patent: 4921564 (1990-05-01), Moore
patent: 5095613 (1992-03-01), Hussinger et al.
patent: 5098501 (1992-03-01), Nishiguchi
patent: 5154793 (1992-10-01), Wojnarowski et al.
patent: 5745983 (1998-05-01), Quintana et al.
patent: 5911850 (1999-06-01), Zung
patent: 5987725 (1999-11-01), Church et al.
patent: 6081991 (2000-07-01), Tsunoda et al.
patent: 6093083 (2000-07-01), Lackey
patent: 6332264 (2001-12-01), Itoh et al.
patent: 6374479 (2002-04-01), Sasaki et al.
patent: 6547918 (2003-04-01), Nomura et al.
patent: 6551438 (2003-04-01), Tanemura
patent: 20020016130 (2002-02-01), Nomura et al.
patent: 20030119421 (2003-06-01), Nomura et al.
patent: 3295017 (1991-12-01), None
patent: 9207044 (1997-08-01), None
patent: 9270114 (1997-10-01), None

Affiliated with

Also associated with

Rating

Method of automatically debonding, processing, and handling... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of automatically debonding, processing, and handling..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of automatically debonding, processing, and handling... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3400749