Method for manufacturing an integrated lead suspension

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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C029S603050, C029S603070, C029S603120, C029S603130, C029S603140, C029S854000, C360S244100, C360S244200, C360S244300, C360S244800, C360S245800, C360S245900

Reexamination Certificate

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06944936

ABSTRACT:
A method for manufacturing an integrated lead suspension or component having an integrated circuit (IC) with an array of terminals. The suspension or component is formed from a laminated sheet of material including a spring metal layer and a conductive material layer separated by an insulating layer. The method includes forming an IC window in the spring metal layer, forming integrated conductive leads in the conductive material layer and forming holes in the insulating layer. The IC can then be mounted to the suspension or component in the IC window, and the array of terminals electrically interconnected to the integrated conductive leads through the insulating layer.

REFERENCES:
patent: 5055969 (1991-10-01), Putnam
patent: 5615477 (1997-04-01), Sweitzer
patent: 5781380 (1998-07-01), Berding et al.
patent: 5844751 (1998-12-01), Bennin et al.
patent: 5864445 (1999-01-01), Bennin et al.
patent: 6014289 (2000-01-01), Goss
patent: 6266213 (2001-07-01), Hiraoka
patent: 6282062 (2001-08-01), Shiraishi
patent: 6437944 (2002-08-01), Ohwe et al.
patent: 6483669 (2002-11-01), Krinke
patent: 0902427 (1999-03-01), None
patent: 0911812 (1999-04-01), None
patent: 62-217476 (1987-09-01), None
patent: 63-292412 (1988-11-01), None
patent: 3-25717 (1991-04-01), None
patent: 03187295 (1991-08-01), None
patent: 10247310 (1998-09-01), None
patent: 3-272015 (1999-03-01), None
“Chip on suspension MR head”; Shiraishi, M.; IEMT/IMC Symposium, 2nd 1998 , Apr. 15-17, 1998 pp.: 333-336.

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