Semiconductor chip and method for producing housing

Details Semiconductor chip and method for producing housing Semiconductor chip and method for producing housing

2005-04-05

2005-04-05

Nelms, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S680000

Reexamination Certificate

active

06876090

ABSTRACT:
A selective encapsulation is produced which covers the connection pads and bonding wires with a potting compound and leaves free active regions, in particular a bearing area for a finger in a fingerprint sensor, by the chip surface being selectively adapted by different roughness or coating and/or the viscosity of the potting compound being altered by irradiation thereof.

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patent: 0 319 175 (1989-06-01), None
patent: 0 789 334 (1997-08-01), None
patent: 61032535 (1986-02-01), None

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