Method of making chip package with grease heat sink

Details Method of making chip package with grease heat sink Method of making chip package with grease heat sink

2005-07-19

2005-07-19

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S107000, C438S112000, C257S685000, C257S686000, C257S687000, C257S718000

Reexamination Certificate

active

06919220

ABSTRACT:
The present invention relates to enhanced protection of the active surface and the bond wires or ball array of a microelectronic device, and to thermal management of the microelectronic device as it is packaged with a printed circuit board (PCB) or other substrate. The enhanced protection and thermal management are accomplished with a high-temperature thermal grease that is glob topped or encapsulated over the bond wires or ball array, and the active surface of the microelectronic device. The high-temperature thermal grease exchanges heat, particularly by conduction, away from the active surface of the microelectronic device as well as away from the bond wires.

REFERENCES:
patent: 4887148 (1989-12-01), Mu
patent: 5475040 (1995-12-01), Jamison et al.
patent: 5583378 (1996-12-01), Marrs et al.
patent: 5633535 (1997-05-01), Chao et al.
patent: 5729050 (1998-03-01), Kim
patent: 5767447 (1998-06-01), Dudderar et al.
patent: 5780928 (1998-07-01), Rostoker et al.
patent: 5786631 (1998-07-01), Fishley et al.
patent: 5834337 (1998-11-01), Unger et al.
patent: 5843810 (1998-12-01), Sato et al.
patent: 5891755 (1999-04-01), Edwards et al.
patent: 5907189 (1999-05-01), Mertol
patent: 5910010 (1999-06-01), Nishizawa et al.
patent: 5930893 (1999-08-01), Eaton
patent: 6011304 (2000-01-01), Mertol
patent: 6175157 (2001-01-01), Morifuji
patent: 6215180 (2001-04-01), Chen et al.
patent: 6218202 (2001-04-01), Yew et al.
patent: 6352879 (2002-03-01), Fukui et al.
patent: 6359335 (2002-03-01), Distefano et al.
patent: 6376908 (2002-04-01), Gaku et al.
patent: 6410988 (2002-06-01), Caletka et al.
patent: 362023138 (1987-01-01), None
R Hundadi et al., High Thermal Conductivity Greases, pp 28-32, (Advanced Packaging, Apr. 1999).
R. Hundadi, et al., High Thermal Conductivity Greases,: pp. 28-32, Advanced Packaging, Apr. 1999).
R. Hundadi, et al., High Thermal Conductivity Greases,: pp. 28-32, Advanced Packaging, Apr. 1999).
R. Hundadi, et al., High Thermal Conductivity Greases,: pp. 28-32, Advanced Packaging, Apr. 1999.

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