Semiconductor device having a flip-chip construction

Details Semiconductor device having a flip-chip construction Semiconductor device having a flip-chip construction

2005-04-26

2005-04-26

Wille, Douglas (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C333S247000

Reexamination Certificate

active

06884656

ABSTRACT:
A semiconductor device includes a mount substrate, a high-frequency transmission line provided on a top surface of the mount substrate, and a semiconductor chip mounted on the top surface of the mount substrate in a facedown state in electrical contact with the high-frequency transmission line, wherein there is formed a depression on the top surface of the mount substrate.

REFERENCES:
patent: 5384486 (1995-01-01), Konno
patent: 5768109 (1998-06-01), Gulick et al.
patent: 5903239 (1999-05-01), Takahashi et al.
patent: 8316368 (1996-11-01), None

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