Method for producing an electronic package possessing...

Details Method for producing an electronic package possessing... Method for producing an electronic package possessing...

2005-01-25

2005-01-25

Chang, Richard (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S846000, C174S262000, C174S263000, C427S097100, C427S099300

Reexamination Certificate

active

06845557

ABSTRACT:
A method for creating an impedance controlled printing wiring board, particularly the formation of a structure for high speed printed wiring boards incorporating multiple differential impedance controlled layers. Furthermore, disclosed is the provision of a method for producing an impedance controlled printed circuit wiring board. Also, there is the provision of a method for producing high speed printed wiring boards with multiple differential impedance controlled layers.

REFERENCES:
patent: 3673680 (1972-07-01), Tanaka et al.
patent: 4610756 (1986-09-01), Strobel
patent: 4661654 (1987-04-01), Strobel
patent: 4783815 (1988-11-01), Buttner
patent: 5281771 (1994-01-01), Swift et al.
patent: 5336855 (1994-08-01), Kahlert et al.
patent: 5822856 (1998-10-01), Bhatt et al.
patent: 6618940 (2003-09-01), Lubert et al.

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