Method of manufacturing double-sided circuit board

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S825000, C029S846000, C029S847000, C427S097100, C427S097200, C428S209000, C430S313000, C430S314000

Reexamination Certificate

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06889432

ABSTRACT:
A method for manufacturing a double-sided circuit board from a board material having a first electric conductor layer and a first electrically insulating layer, including the steps of: making conduction holes in the board material so as to penetrate only the first electrically insulating layer or both the first electrically insulating layer and the first electric conductor layer; forming an electrically conductive thin-film layer on a surface of the first electrically insulating layer and wall surfaces of the conduction holes; forming a second electrically insulating layer on the electrically conductive thin-film layer; forming a first electric conductor wiring by electroplating on predetermined portions of the electrically conductive thin-film layer; covering the first electric conductor wiring with a chemical-resistant film; forming a second electric conductor wiring by chemically dissolving a predetermined portion of another surface of the first electric conductor layer; and removing the second electrically insulating layer and the film.

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Japanese Abstract No. 05291727, dated Nov. 5, 1993.
Japanese Abstract No. 2000151079, dated May 30, 2000.
“Process for Manufacturing Multilayer Tab”, Research Disclosure, Kenneth Mason Publications, Hampshire, GB, No. 373, May 1, 1995, pp. 303-307, XP000518622.

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