Wiring board, and electronic device with an electronic part...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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Details

C174S262000, C361S760000, C361S779000

Reexamination Certificate

active

06878884

ABSTRACT:
An electronic device is mounted on a wiring board, which includes: a substrate having through holes, and lands extending on surfaces of the substrate and adjacent to openings of the through holes. Further, at least one coating layer is provided, which coats at least one part of an outer peripheral region of the at least one land, in order to cause that the at least one part is separated from a lead-less solder, thereby preventing any peel of the land from the surface of the substrate.

REFERENCES:
patent: 4170819 (1979-10-01), Peter et al.
patent: 4410928 (1983-10-01), Aramaki
patent: 5398166 (1995-03-01), Yonezawa et al.
patent: 5953214 (1999-09-01), Dranchak et al.
patent: 6512185 (2003-01-01), Itou
patent: 6657135 (2003-12-01), Suetsugu et al.
patent: 10-051111 (1998-02-01), None
patent: 11-251728 (1999-09-01), None
patent: 2001-244614 (2001-09-01), None
patent: 2001-332851 (2001-11-01), None

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