Heat transfer apparatus

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S695000, C361S699000, C361S719000, C257S714000, C257S715000, C174S015200, C165S080400

Reexamination Certificate

active

06873527

ABSTRACT:
The invention relates to heat transfer apparatus for cooling electronic components. There is a continuously increasing demand for compact electronic systems such as portable laptop computers and thirst for high processing power, leading to high heat generated by components residing within these systems. These electronic systems have to be cooled due to their fixed operating temperature ranges. Operating an electronic component beyond its rated operating temperature range will damage electronic components. Instead of conventionally utilising a bigger fan, a smaller sized solution is required for cooling an electronic component contained in a compact electronic system, for example a notebook computer. A heat transfer apparatus includes a heat carrier for conveying heat away from the electronic system into a radiator for dissipation. The radiator is placed into a cooler for directing air through the radiator and expelling heated air, cooling the radiator in the process.

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N. Thang et al., Use of Heat Pipe/Heat Sink for Thermal Management of High Performance CPUs, 16thIEEE Semi-Therm Symposium, 2000, pp. 76-79.

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