Apparatus and methods for reducing damage to substrates...

Cleaning and liquid contact with solids – Processes – Including application of electrical radiant or wave energy...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C134S034000, C134S137000, C134S148000, C134S151000, C134S153000, C134S184000, C134S198000, C134S902000, C310S311000, C310S320000, C310S367000, C310S368000, C310S369000, C310S370000, C438S906000

Reexamination Certificate

active

06892738

ABSTRACT:
The present invention provides a megasonic cleaning apparatus configured to provide effective cleaning of a substrate without causing damage to the substrate. The apparatus includes a probe having one of a variety of cross-sections configured to decrease the ratio of normal-incident waves to shallow-angle waves. One such cross-section includes a channel running along a portion of the lower edge of the probe. Another cross-section includes a narrow lower edge of the probe. Another cross-section is elliptical. Another cross-section includes transverse bores originating in the lower edge of the probe. As an alternative to, or in addition to, providing a probe having a cross-section other than circular, the present invention may also provide a probe having a roughened lower surface.

REFERENCES:
patent: 4401131 (1983-08-01), Lawson
patent: 4537511 (1985-08-01), Frei
patent: 5975098 (1999-11-01), Yoshitani et al.
patent: 6021785 (2000-02-01), Grutzediek et al.
patent: 6039059 (2000-03-01), Bran
patent: 6140744 (2000-10-01), Bran
patent: 6295999 (2001-10-01), Bran
patent: 6524251 (2003-02-01), Rabiner et al.
patent: 6568408 (2003-05-01), Mertens et al.
patent: 20040020512 (2004-02-01), Hosack et al.
patent: 0 044 800 (1982-01-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus and methods for reducing damage to substrates... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and methods for reducing damage to substrates..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and methods for reducing damage to substrates... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3391668

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.