Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1994-12-30
1997-04-22
Simmons, David A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156249, 156344, 7320426, 148DIG135, 216 20, 437974, B32B 3100
Patent
active
056225865
ABSTRACT:
Method of fabricating a device made of a thin diamond film having a thickness of less than 10 .mu.m which is difficult to handle. The method is initiated by forming a thin diamond film on a silicon substrate to a thickness of about 5 .mu.m by chemical vapor deposition. Then, paraffin is applied. The substrate is removed with hydrofluoric acid. Thus, the diamond film is retained on the paraffin that is made to act as a base. A required circuit is formed on the surface of the diamond film. Finally, the paraffin is removed. In this way, a device using the diamond film is completed. This structure can be used as a device for measuring thermal effect, using a thin diamond film. For example, the structure can be used for fabrication of a flowsensor.
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Inushima Takashi
Kadono Masaya
Vaitkus Rimantas
Ferguson Jr. Gerald J.
Rivard Paul M.
Semiconductor Energy Laboratory Co,. Ltd.
Simmons David A.
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