Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate
2005-04-19
2005-04-19
Fourson, George (Department: 2823)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Reexamination Certificate
active
06881647
ABSTRACT:
Systems and methods are described for synthesis of films, coatings or layers using templates. A method includes locating a template within at least one of a first precursor layer that is coupled to a first substrate and a second precursor layer that is coupled to a second substrate; forming a composition layer; and moving the first substrate relative to the second substrate, wherein the composition layer remains coupled to the second substrate.
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Fourson George
HelioVolt Corporation
John Bruckner PC
Kebede Brook
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