Method for providing electrical interconnections between adjacen

Details Method for providing electrical interconnections between adjacen Method for providing electrical interconnections between adjacen

1995-01-23

1997-02-11

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156292, 156295, 29830, 29852, 427 97, B29C 6548, H05K 342, H05K 346

Patent

active

056016786

ABSTRACT:
A method of forming a multi-layer circuit board which includes electrical interconnections between adjacent circuit board layers of the multi-layer board. A via hole is provided through a circuit board layer. The via hole is filled with a via metal. The via metal is plated with a low melting point metal. An adhesive film is deposited over the circuit board layer. Adjacent layers of the multi-layer circuit board are stacked and aligned together. The layers are laminated under heat and pressure. The low melting point metal provides an electrical interconnection between adjacent layers.

REFERENCES:
patent: 4238527 (1980-12-01), Monnier et al.
patent: 4554033 (1985-11-01), Dery et al.
patent: 4576670 (1986-03-01), Schade
patent: 4925723 (1990-05-01), Bujatti et al.
patent: 5046238 (1991-09-01), Daigle et al.

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