Semiconductor device and manufacturing method for the same,...

Details Semiconductor device and manufacturing method for the same,... Semiconductor device and manufacturing method for the same,...

2005-07-26

2005-07-26

Clark, S. V. (Department: 2815)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S110000, C438S126000

Reexamination Certificate

active

06921683

ABSTRACT:
To improve the productivity of manufacturing semiconductor devices having a heat sink, the semiconductor device manufacturing method includes: (a) setting an integral heat radiation body set30of multiple heat radiation bodies32in a mold40cavity42;(b) setting a substrate10on which multiple semiconductor chips20are mounted in a planar arrangement in the mold40so that the multiple semiconductor chips20are located inside the cavity42;and (c) sealing the multiple semiconductor chips20and affixing the heat radiation body set30by filling the cavity42with a sealant.

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patent: 5485037 (1996-01-01), Marrs
patent: 6246115 (2001-06-01), Tang et al.
patent: 6278182 (2001-08-01), Liu et al.
patent: 6720647 (2004-04-01), Fukuizumi
patent: 7-321246 (1995-12-01), None
patent: 11-026658 (1999-01-01), None

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