Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1994-12-06
1997-02-11
Osele, Mark A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156344, 2940208, 228191, 228264, 428458, 428901, 437209, 437923, B32B 3500
Patent
active
056016751
ABSTRACT:
An electronics device has unpackaged chips or other small components mounted on a carrier and wire-bonded to carrier wiring traces. The rear chip faces have a layer of adhesive which overlies a layer of solder or other fusible material, and which adheres to a pad area of the carrier. To replace a chip, its solder layer is melted, and the chip and adhesive are pulled off. Reapplying an adhesive layer allows a new chip to be mounted on the carrier and bonded to the traces.
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Hoffmeyer Mark K.
Sluzewski David A.
Bussan Matthew J.
Dillon Andrew J.
International Business Machines - Corporation
Osele Mark A.
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