Fan-less housing

Details Fan-less housing Fan-less housing

2005-01-04

2005-01-04

Thompson, Gregory (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080300, C165S185000, C257S722000, C361S703000, C361S704000, C361S702000, C361S715000, C361S710000, C361S688000

Reexamination Certificate

active

06839232

ABSTRACT:
In a heat dissipating internally fan-less housing (20) for electronic circuits and components (28), the housing has an assembly of two container (10) parts comprising heat-sink fins (12). Each part has a substantially diagonal (14) shaped profile. In the housing, a circuit-board (29) is mounted along the diagonal (14) profile thus providing that the long-side ends of the circuit-board (29) on each side of the board are covered by a greater mass of heat-sink fins (12) compared to a horizontally mounted circuit board for a better cooling of components.

REFERENCES:
patent: 5109318 (1992-04-01), Funari et al.
patent: 5461542 (1995-10-01), Kosak et al.
patent: 5473511 (1995-12-01), Reddy et al.
patent: 5812372 (1998-09-01), Galyon et al.
patent: 6175501 (2001-01-01), Bortolini et al.
patent: 6680849 (2004-01-01), Atkinson et al.

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