Semiconductor package insulation film and manufacturing...

Details Semiconductor package insulation film and manufacturing... Semiconductor package insulation film and manufacturing...

2005-04-05

2005-04-05

Pert, Evan (Department: 2829)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C438S113000, C438S460000

Reexamination Certificate

active

06875637

ABSTRACT:
An insulation film for providing an insulation substrate carrying a semiconductor chip of a semiconductor package. Insulation film10is provided with rows of opposing sprocket holes12formed on either edge of the above mentioned insulation film, and through holes14are disposed two-dimensionally between the rows of sprocket holes12. Pitch p between through holes14is determined by the relationship m p=n L (i.e., n and m are integers, and n<m), wherein pitch of the sprocket holes is taken to be L. Through holes14are selectively utilized during formation of the desired circuit pattern upon insulation film10according to size of the manufactured semiconductor package.

REFERENCES:
patent: 6192579 (2001-02-01), Hayashi et al.
patent: 6200824 (2001-03-01), Hashimoto
patent: 6235555 (2001-05-01), Cho

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